Your boss decides that the use of levitation in modern electronics packaging is not sustainable...

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Your boss decides that the use of levitation in modern electronics packaging is not sustainable due to recent surges in magic and its general unpredictability. Instead, you are forced to mount the chip to a 5 mm thick ceramic substrate (k = 1 W/mK) with a contact resistance of 5x10-4 mK/W. Assume the same convection conditions are applied to the assembly as in problem (1). What is the chip temperature during operation now

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