Quiz on Reliability, ESD, Ethics Conduct. Select thecorrect answer for each

a) How is a product expected to failafter a very long time in use?

-Metal electromigration will short out the power supply

-Wearout

-MOS gate oxide will burst

-Electrical overstress

-The \"divide\" function will start losing bits randomly

b) Is there an issue preventing continuous improvementfor better reliability in manufacturing?

-Customers who design high reliability products with yoursemiconductor parts will not allow substantial changes inmanufacturing once the process is released

-No, customers demand continuous process improvement and lowerprice regardless of what needs to be changed

-Once the process achieves Six Sigma qualification on 3parameters, no further change is permitted

-Customers expect the manufacturer to buy newer equipment everyyear to improve product reliability

-Manufacturers can always change the specification limits, butare not permitted to reduce variation

c) Explain HBM ESD?

-System power is cycled off to drain the charge, then the humanaccumulates an equivalent charge

-A cable connects from a human to the test board, causing avisible arc

-The semiconductor part is charged, and then zaps itself whenmetal contact is made

-Charged person grounds herself through a wriststrap, causing afast discharge

-Charged person makes electrical contact with metal of asemiconductor part, causing a fast discharge

d) Why is prevention of CDM a highpriority among manufacturers?

-VDM discharges can be so fast that even a small amount ofstored charge can cause damage, and discharge may happen multipletimes

-The slow discharge tends to drain batteries without you knowingit

-CDM occurs at so much higher voltage than HBM that it's muchmore dangerous

-Rules for prevention of CDM are more difficult and cost muchmore money to implement

-It's embarrassing when your customers find out that you havethe same problem as them