QUESTION 1 What is NOT a solid reason to recommend sputtering in Argon instead of e-beam deposition? 1. You...

60.1K

Verified Solution

Question

Electrical Engineering

QUESTION 1
What is NOT a solid reason to recommend sputtering in Argoninstead of e-beam deposition?
1.
You want purer films with no trapped inert gas.
2.
You want better film adhesion.
3.
You want to deposit a multicomponent film like, TiW.
4.
You want better step coverage.
10 points Â Â
QUESTION 2
What is NOT a solid reason to recommend e-beam deposition ofaluminum over sputtering in Argon?
1.
We want the higher throughput (# wafers processed per hour)offered by e-beam deposition.
2.
The high temperatures required to get an acceptable depositionrate will scorch the aluminum film and degrade its resistivity.
3.
We want to avoid damaging the wafer by exposing it to aplasma.
4.
We want \"line of sight\" deposition to create special featuresthat rely on portions of the wafer being blocked fromdeposition.

Answer & Explanation Solved by verified expert

3.6 Ratings (293 Votes)

Question 1 What is NOT a solid reason to recommend sputtering in Argon instead of ebeam deposition Explanation Sputtering process involves ejecting material from a target that is a source onto a substrate such as a silicon wafer in a vacuum chamber This effect is See Answer

Get Answers to Unlimited Questions

Join us to gain access to millions of questions and expert answers. Enjoy exclusive benefits tailored just for you!

Membership Benefits:

Unlimited Question Access with detailed Answers
Zin AI - 3 Million Words
10 Dall-E 3 Images
20 Plot Generations
Conversation with Dialogue Memory
No Ads, Ever!
Access to Our Best AI Platform: Flex AI - Your personal assistant for all your inquiries!

Become a Member

	1.	You want purer films with no trapped inert gas.
	2.	You want better film adhesion.
	3.	You want to deposit a multicomponent film like, TiW.
	4.	You want better step coverage.

	1.	We want the higher throughput (# wafers processed per hour)offered by e-beam deposition.
	2.	The high temperatures required to get an acceptable depositionrate will scorch the aluminum film and degrade its resistivity.
	3.	We want to avoid damaging the wafer by exposing it to aplasma.
	4.	We want \"line of sight\" deposition to create special featuresthat rely on portions of the wafer being blocked fromdeposition.