Failure times of silicon wafer microchips. Researchers atNational Semiconductor experimented with tin-lead solder bumps usedto manufacture silicon wafer integrated circuit chips. The failuretimes of the microchips (in hours) were determined at differentsolder temperatures (degrees Centigrade). The data for oneexperiment are saved in WAFER file. The researchers want to predictfailure time (y) based on solder temperature (x). a. Construct ascatterplot for the data. What type of relationship, linear orcurvilinear, appears to exist between failure time and soldertemperature? b. Fit the model, ? = ?0 + ?1? + ?2?2 + ?, to thedata. Give the least squares prediction equation. c. Conduct a testto determine if there is upward curvature in the relationshipbetween failure time and solder temperature. (Use α = .05) Pleaseuse R studio software to get data. TEMP FAILTIME 165 200 162 200164 1200 158 500 158 600 159 750 156 1200 157 1500 152 500 147 500149 1100 149 1150 142 3500 142 3600 143 3650 133 4200 132 4800 1325000 134 5200 134 5400 125 8300 123 9700
