2, Die deprocessing.
a) Name TWO materials that typically made up the passivationlayers.
b) Reactive Ion Etching (RIE) is a type of dry etching which isof plasma-based. With an aid of diagram, explain the mechanism ofRIE.
c) Wet etching and dry etching are the most common diedeprocessing techniques. Give TWO advantages and disadvantages ofwet etching in form of tables.
